基本素養 Basic Literacy

科技人文素養
Technological and Cultural literacy
環境與社會關懷
Environmental and Social Care
溝通合作能力與國際宏觀視野
Ability to communicate effectively with others and work in a team with developed international perspective.

核心能力 Competence

專業與跨域能力
Professional and interdisciplinary capacity
創新思考及定義、獨立解決問題之能力
Innovative thinking as well as the ability to define and solve problems independently
語文與溝通能力,進而協調跨領域人員整合
Language and communication skills to coordinate the integration of interdisciplinary personnel
設計、驗證及與產業實作整合之能力,攜手促進產業轉型升級
The ability to design, verify, and integrate with industrial implementations, and work together to promote industrial transformation and upgrading
自我學習成長之能力:國際視野、基本素養
Developed sense of self- improvement: International Perspective, Principle Literacy

課程概述 Course Description

本課程將介紹半導體積體電路晶片的製作流程,從基本材料特性出發到電子電路元件的整體製作過程,進行詳盡完整的介紹。內容將規劃積體電路元件特性簡介及積體電路製程介紹,製成介紹中包含擴散、黃光、蝕刻、薄膜及化學機械研磨等多道製程,為此課程之基礎,課程最後將會帶到最先進的半導體製程技術,如:鰭式場效電晶體(FinFETs)、閘極全環場效電晶體(GAAFETs)等。
This course will aim on the introduction to semiconductor manufacturing technology, starting from the fundamental materials properties to full process integration flow of electronic devices. The content includes the device characteristics of the integrated circuit and the process steps include diffusion, photolithography, etching, thin film deposition and chemical-mechanical polishing, which form the cornerstone of this course. The final part involves the advanced semiconductor manufacturing processes including FinFETs, GAAFETs and so on.

課程學習目標 Course Objectives

  • 熟悉半導體元件特性
  • 了解半導體元件製作方式
  • 理解最新半導體元件技術進展
  • 課程進度 Progress Description

    進度說明 Progress Description
    1The Introduction of ULSI and Semiconductor Device Physics: Basic Devices and Circuits
    2History of lithography (ASML)
    3Lithography performance (ASML)
    4Inside a lithography scanner (ASML)
    5Holistic patterning & Applications (ASML)
    6Advanced Lithography – now and future (ASML)
    7ASML企業參訪
    8The Introduction of Process modules: Thermal Processes, Ion Implantation
    9Midterm
    10The Introduction of Process modules: Wet and Dry Etch
    11The Introduction of Process modules: CVD and Dielectric Film
    12The Introduction of Process modules: Metallization-ALD/CVD/PVD
    13The Introduction of Process modules: Chemical Mechanical Polishing
    14CMOS Process Integration: CMOS Process Flow
    15CMOS Process Integration: Strain/High-k and Metal Gate processes
    16Advanced CMOS Process: Fin-FETs and GAA-FETs
    17Process Control Monitoring/Statistical Process Control: CD/AA/TK/WAT
    18Final
     以上每週進度教師可依上課情況做適度調整。The schedule may be subject to change.

    課程是否與永續發展目標相關調查
    Survey of the conntent relevant to SDGs

    本課程與SDGs相關項目如下:
    This course is relevant to these items of SDGs as following:
    • 教育品質 (Quality Education)
    • 就業與經濟成長 (Decent work and Economic growth)

    有關課程其他調查 Other Surveys of Courses

    1.本課程是否規劃業界教師參與教學或演講? 是,約 6 次
    Is there any industry specialist invited in this course? How many times? Yes, about 6 times.
    2.本課程是否規劃含校外實習(並非參訪)? 否
    Are there any internships involved in the course? How many hours? No
    3.本課程是否可歸認為學術倫理課程? 否
    Is this course recognized as an academic ethics course? In the course how many hours are regarding academic ethics topics? No
    4.本課程是否屬進入社區實踐課程? 否
    Is this course recognized as a Community engagement and Service learning course? Which community will be engaged? No

    教師上傳大綱內容
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    SOC-課程大綱-半導體先進製程概論.pdf