基本素養 Basic Literacy

人文與倫理素養
Quality of humanism and ethics.
誠信素養
Integrity.
社會關懷
Care for society.

核心能力 Competence

工程領域之專業知識
Professional knowledge in engineering field.
策劃及執行專題研究之能力
Plan and execute case study.
撰寫專業論文之能力
Write professional essays.
創新思考及獨立解決問題之能力
Creative thinking and independent problem-solving ability.
與不同領域人員協調整合之能力
Integration and negotiation with other fields’ experts.
廣闊之國際視野
Wide global vision.
領導、管理及規劃的能力
Leadership, management, arrangement ability.
終身自我學習成長之能力
Lifelong self-learning ability.
國際視野
Global vision.

課程概述 Course Description

介紹電子系統構裝之材料、構裝方法(含DIP,SMT,Flip-Chip,MCM及多層基板等)、電性設計(含佈局、拉線及EMI)、散熱設計、系統設計與可靠度分析等
Introduce the materials and methods of electronic system assembly (including DIP, SMT, Flip-Chip, MCM and multilayer substrates), electrical design (including layout, cable and EMI), heat dissipation design, system design and reliability analysis

課程學習目標 Course Objectives

  • 應用數學、科學及工程知識的能力元件之能力
  • 設計與執行實驗,以及分析與解釋數據的能力
  • 執行工程系統與培養跨領域工程模擬與分析之能力
  • 課程進度 Progress Description

    進度說明 Progress Description
    1構裝材料
    2構裝方法(DIP)
    3構裝方法(SMT)
    4構裝方法(Flip-Chip)
    5構裝方法(Flip-Chip)
    6構裝方法(MCM)
    7構裝方法(MCM)
    8構裝方法(多層基板)
    9期中考
    10構裝方法(多層基板)
    11構裝方法(其他方法)
    12構裝方法(其他方法)
    13散熱設計(含佈局、拉線及EMI)
    14散熱設計(含佈局、拉線及EMI)
    15系統設計與可靠度分析
    16系統設計與可靠度分析
    17系統設計與可靠度分析
    18期末考
     以上每週進度教師可依上課情況做適度調整。The schedule may be subject to change.

    有關課程其他調查 Other Surveys of Courses

    1.本課程是否規劃業界教師參與教學或演講?
    Is there any industry specialist invited in this course? How many times?
    2.本課程是否規劃含校外實習(並非參訪)?
    Are there any internships involved in the course? How many hours?
    3.本課程是否可歸認為學術倫理課程? 否
    Is this course recognized as an academic ethics course? In the course how many hours are regarding academic ethics topics? No
    4.本課程是否屬進入社區實踐課程?
    Is this course recognized as a Community engagement and Service learning course? Which community will be engaged?