NCKU Curriculum Map
1. 2.
3.
Engineering Science    Development For

Recommended Subjects
Intensively Recommended Subjects Recommended
SEMINAR (2) (Graduate school)
SEMINAR (1) (Graduate school)
SEMINAR (3) (Graduate school)
SEMINAR (Graduate school)
SEMINAR (4) (Graduate school)
COMPUTATIONAL FLUID MECHANICS AND HEAT TRANSFER (Graduate school)
GAS DYNAMICS (Graduate school)
SOLID MECHANICS (1) (Graduate school)
SOLID MECHANICS (1) (Graduate school)
FINITE ELEMENTS(1) (Graduate school)
VISCOUS FLUID MECHANICS (Graduate school)
MECHANICS OF VIBRATIONS (Graduate school)
THERMOVISCOELASTICITY (Graduate school)
THEORY OF ELASTICITY (Graduate school)
INTRODUCTION TO FATIGUE AND FRACTURE MECHANICS (Graduate school)
STRESS ANALYSIS OF ELECTRONIC PACKAGING (Graduate school)
INTELLIGENT ROBOTS (Graduate school)
FRACTURE MECHANICS (Graduate school)
MECHANICS OF COMPOSITE MATERIALS (Graduate school)
DYNAMICS OF STRUCTURE (Graduate school)
KNOWLEDGE MANAGEMENT (Graduate school)
SYSTEM SIMULATION (Graduate school)
COMPUTATION OF FLUID MECHANICS (Graduate school)
SOLIDIFICATION PROCESSING (Graduate school)
ADVANCED APPLIED MATHEMATICS (Graduate school)
FATIGUE ANALYSIS AND DESIGN (Graduate school)
PHYSICAL FLUID MECHANICS (Graduate school)
ADVANCED NUMERICAL ANALYSIS (Graduate school)
ADVANCED HEAT TRANSFER (Graduate school)
TAGUCHI METHODS FOR QUALITY DESIGN (Graduate school)
MICRO-/NANO-SCALE TRANSPORT PHENOMENA (Graduate school)
HEAT TRANSFER ON ELECTRONIC PACKAGINGS (Graduate school)
INTRODUCTION TO ELECTRONIC PACKAGING (Graduate school)
COMPUTER-AIDED IESIGN OF IC PACKAGING (Graduate school)
RELIABILITY ANALYSIS IN ELECTRONIC PACKAGING STRUCTURES (Graduate school)
THEORY OF PLASTIC DEFORMATION (Graduate school)
COMPUTER AIDED ENGINEERING ANALYSES AND DESIGN (Graduate school)