NCKU Curriculum Map
1. 2.
3.
SOLID MECHANICS IN ELECTRONIC PACKAGE

This course undertakes the "vector analysis" method of university department mechanics and introduces the "cassette tensor analysis" method to establish strain and stress tensor, the theorem and formula of conjoined mechanics. Structural material behavior and stress / strain relationship. The application is mainly based on the analysis of the thermal stress of the structural laminates based on thermoelasticity and the mechanical behavior of the encapsulated solder balls under thermal cycling.

Course Goal
A. Cultivate professional research experts.
Course Principle Literacy and Competence
[Competence]
  • Professional knowledge in engineering field.
  • Plan and execute case study.
  • Creative thinking and independent problem-solving ability.
  • Courses of Recent Years
    Year/
    Semester
    Course
    Number
    Class
    Code
    Course Name
    (The name will link to the syllabus.)
    Credit Taught in English
    (Yes or No)
    Instructor
    0109/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0108/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0107/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0106/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0105/2 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0104/2 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0103/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Chen, Rong-Sheng
    0102/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Chen, Rong-Sheng
    0101/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Chen, Rong-Sheng
    0100/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Chen, Rong-Sheng
    0099/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Lee, Chau-Fei
    0098/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Lee, Chau-Fei